Part A+B | 20 kg set |
Part A | 15.8 kg container |
Part B | 4.2 kg container |
Part A – Resin
Liquid, brownish-transparent
Part B – HardenerLiquid, yellow-transparent
Chemical base
Epoxy
Shelf life
12 months from date of production if stored properly in original, unopened and undamaged sealed packaging.
Storage conditions
The product must be stored in original, unopened and undamaged sealed packaging in dry conditions at temperatures between +10 °C and +30 °C
Density
Part A | ~1.6 kg/L |
Part B | ~1.0 kg/L |
Mixed Resin | ~1.45 kg/L |
Solid content by weight
~100 %
Solid content by volume
~100 %
Shore D hardness
~76 (7 d, +27 °C) | (DIN 53 505) |
Compressive strength
~50 N/mm2 (resin : Sika® Quartz 01 IN = 1 : 0.9) (28 d, +27 °C) | (EN 196-1) |
Flexural strength
~30 N/mm2 (resin : Sika® Quartz 01 IN = 1 : 0.9)(28 d, +27 °C) | (EN 196-1) |
Tensile adhesion strength
> 1.5 N/mm2 (failure in concrete) | (EN 1542) |
Heat resistance
IMPORTANT
No simultaneous mechanical and chemical strain
While the product is exposed to temperatures up to +60 °C, do not also subject it to chemical and/or mechanical strain, as it may cause damage to the product.
Exposure | Dry heat |
Short-term, maximum 7 days | +60 °C |
Chemical resistance
Resistant to many chemicals. Please ask for a detailed chemical resistance table.
Mixing ratio
Part A : Part B = 79 : 21 (by weight)
Ambient air temperature
+10 °C min. / +30 °C max.
Relative air humidity
80 % r.h. max.
Dew point
Beware of condensation!
The substrate and uncured floor must be at least +3 °C above dew point to reduce the risk of condensation or blooming on the floor finish.
Note: Low temperatures and high humidity conditions increase the probability of blooming.
Substrate temperature
+10 °C min. / +30 °C max.
Substrate moisture content
< 4 % pbw moisture content.
Test method: Sika®-Tramex meter, CM-measurement or Oven-dry-method.
No rising moisture according to ASTM (Polyethylene-sheet).
Pot life
Temperature | Time |
+10 °C | ~50 min |
+20 °C | ~25 min |
+30 °C | ~15 min |
Curing time
Before applying solvent free products on Sikafloor®-161 HC allow:
Substrate temperature | Minimum | Maximum |
+10 °C | 24 h | 4 d |
+20 °C | 12 h | 2 d |
+30 °C | 8 h | 24 h |
Before applying solvent containing products on Sikafloor®-161 HC allow:
Substrate temperature | Minimum | Maximum |
+10 °C | 36 h | 6 d |
+20 °C | 24 h | 4 d |
+30 °C | 16 h | 2 d |
Times are approximate and will be affected by changing ambient conditions particularly temperature and relative humidity.
Applied product ready for use
Substrate temperature | Foot traffic | Light traffic | Full cure |
+10 °C | ~24 h | ~6 d | ~10 d |
+20 °C | ~12 h | ~4 d | ~7 d |
+30 °C | ~8 h | ~2 d | ~5 d |
Note: Times are approximate and will be affected by changing ambient and substrate conditions.
Consumption
Coating System | Product | Consumption |
Priming | Sikafloor®-161 HC | 0.25–0.50 kg/m2 |
Bonding bridge | Sikafloor®-161 HC | 0.25–0.50 kg/m2 |
Levelling mortar fine (surface roughness < 1 mm) | 1 pbw Sikafloor®-161 HC + 0.5 pbw Sika® Quartz 04 IN | 1.7 kg/m2/mm |
Levelling mortar medium (surface roughness up to 2 mm) | 1 pbw Sikafloor®-161 HC + 0.8 pbw Sika® Quartz 01 IN | 1.8 kg/m2/mm |
Epoxy screed (15–20 mm layer thickness) / Repair mortar | 1 pbw Sikafloor®-161 HC + 7 pbw quartz sand | 2.2 kg/m2/mm |
Note: These figures are theoretical and do not allow for any additional material required due to surface porosity, surface profile, variations in level, wastage or any other variations etc. Apply product to a test area to calculate the exact consumption for the specific substrate conditions and proposed application equipment.
SUBSTRATE QUALITY
SUBSTRATE PREPARATION
MECHANICAL SUBSTRATE PREPARATION
IMPORTANT
Exposing blow holes and voids
When mechanically preparing the surface, make sure to fully expose blow holes and voids.
Contact Sika® Technical Services for additional information on products for levelling and repairing defects.
TREATMENT OF JOINTS AND CRACKS
Construction joints and existing static surface cracks in substrate require pre-treating before full layer application. Use Sikadur® or Sikafloor® resins.
MIXING
Note: To increase the viscosity of the Product you can add Sika® Extender T or Sikafloor® Quartz Flour.
PRIMER MIXING PROCEDURE
LEVELLING MORTAR AND RESIN SCREED MIXING PROCEDURE
MIXING TOOLS
Sikafloor®-161 HC must be thoroughly mixed using a low speed electric stirrer (300 – 400 rpm) or other suitable equipment. For the preparation of mortars use a forced action mixer of rotating pan, paddle or trough type. Free fall mixers should not be used.
APPLICATION
IMPORTANT
Protect from moisture
Prior to application, confirm substrate moisture content, r.h. and dew point.
If > 4 % pbw moisture content, Sikafloor® EpoCem® may be applied as a T.M.B. (temporary moisture barrier) system.
After application, protect the Product from damp, condensation and direct water contact for at least 24 hours.
Pin holes
If the Product is applied on porous substrates during rising temperatures, pin holes may form from rising air.
Closing Pin holes
If pin holes are present after the Product has cured blistering may occur in the subsequent layer. Close any pin holes using the following steps.
STANDARD PRIMER APPLICATION
LEVELLING MORTAR / SCRATCH COAT
Equipment:
BONDING BRIDGE
RESIN SCREED
IMPORTANT
Not suitable for contact with water
The Product is not suitable for contact with water unless sealed with seal coat.
RESIN PATCH REPAIR MORTAR
CLEANING OF TOOLS
Clean all tools and application equipment with Thinner C immediately after use. Hardened / cured material can only be mechanically removed.