Sikadur®-53 UF Mortar

Moisture insensitive epoxy resin mortar

Sikadur®-53 UF Mortar is a solvent free, three-component moisture insensitive, epoxy resin based mortar. It has been developed to meet special requirement of concrete repair particularly in damp, wet condition. After mixing, the mortar is placed on moist concrete and it cures to form a rigid and high strength material.

Usage

Sikadur®-53 UF Mortar is used for:

Packaging

Part A+B+C Pre-batched unit

10.5 kg x 4 sets

Part A1.00 kg plastic container

Part B

0.50 kg plastic container

Part C

9.00 kg bag

Advantages

Colour

Part A

Clear

Part BReddish Yellow

Part C

Sand

Part A+B+C mixed

Reddish Yellow mortar

Product Details

Chemical Base

Epoxy resin

 
Shelf Life

12 months from date of production

 
Storage Conditions

Store properly in original unopened, sealed and undamaged packaging, in dry conditions at temperatures between +5°C and +40°C. Protect from direct sunshine.

 
Density

Part A+B+C Mixed :  2.1 ± 0.1 kg/L (at +27°C)

Compressive Strength

3 hours

≥ 20 N/mm2

6 hours≥ 25 N/mm2

1 day

≥ 35 N/mm2

7 days

≥ 60 N/mm2

At curing temperature +30°C

 

Tensile Strength in Flexure

1 day

15 N/mm2

7 days

16.5 N/mm2

Curing Temperature  at +30° C

 
Tensile Strength

10.2 N/mm2 (after 7 days at +30° C)

(ISO 527-2)

 
Tensile Adhesion Strength

14 days

Dry concrete

≥ 4 N/mm2

14 days

Moist concrete

≥ 4 N/mm2

At curing temperature +30°C, 100% Concrete failure

 
Heat Deflection Temperature

+47°C (7 days / +30°C)

(ASTM D648)

Application

Mixing Ratio

Part A : Part B : Part C = 2 : 1 : 18 (by weight)

 

Layer Thickness

60 mm max.
When using multiple units, one after the other. Do not mix the following unit until the previous one has been used in order to avoid a reduction in handling time.
 
Flowability

Sag Flow : Non-sag upto 20mm thickness on vertical surface

 

Product Temperature

+10°C min. / +40°C max.

 

Ambient Air Temperature

+5°C min. / +40°C max

 
Substrate Temperature

+5°C min. / +40°C max

 
Pot Life

~ 20 minutes (100 g mass at +27°C)

(FIP 5.1)

 

The potlife begins when the resin and hardener are mixed. It is shorter at high temperatures and longer at low temperatures. The greater the quantity mixed, the shorter the potlife. To obtain longer workability at high temperatures, the mixed adhesive may be divided into portions. Another method is to chill parts A+B and C before mixing them (not below +5°C).

Consumption

~2.1 kg/m2 per mm of thickness.

SUBSTRATE QUALITY

Verify the substrate strength (concrete, masonry, natural stone).

 

The substrate surface (all types) must be clean and free from contaminants such as dirt, oil, grease, existing surface treatments and coatings etc.

 

Steel substrates must be de-rusted similar to Sa 2.5.

 

The substrate must be sound and all loose particles must be removed.

 
SUBSTRATE PREPARATION

Concrete / masonry / mortar / stone
Substrates must be sound, clean and free from laitance, grease, oils, old surface treatments or coatings and all loose or friable particles must be removed to achieve a laitance and contaminant free, open textured surface.

 

Steel
Must be cleaned and prepared thoroughly to an acceptable quality i.e. by blast cleaning and vacuum. Avoid dew point conditions.

 

Other surfaces (polyester, epoxy, glass, ceramic)
On these substrates pre-apply Sikadur®-31 and then, “wet on wet” apply Sikadur®-53 UF Mortar.

 
MIXING

Mix parts A+B together for at least 3 minutes with a mixing spindle attached to a slow speed electric drill (max. 600 rpm) until the material becomes smooth in consistency and a uniform colour. Then add part C and continue until mixture is homogeneous. Avoid aeration while
mixing. The, pour the whole mix into a clean container and stir again for 1 more minute at low speed to keep air entrapment at a minimum. Mix only that quantity which can be used within its potlife.

 
CLEANING OF TOOLS

Clean all tools and application equipment with Sika® Colma Cleaner immediately after use. Hardened / cured material can only be mechanically removed.

 

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